Liquid Cooling Plate Heat Sink Liquid Cooling Plate Heat Sink is a high-performance heat sink that uses liquid cooling technology to dissipate heat generated by electronic devices. It is designed to be used in applications where air cooling is insufficient or impractical. The heat sink is made up of a series of channels that are filled with liquid coolant. The coolant flows through the channels, absorbing heat from the electronic device and carrying it away from the heat sink.The liquid cooling plate heat sink is typically made of materials such as copper or aluminum, which have high thermal conductivity. The channels are designed to maximize the surface area of the heat sink, allowing for efficient heat transfer. The liquid coolant used in the heat sink can be water, glycol, or other specialized fluids that are optimized for heat transfer.One of the main advantages of liquid cooling plate heat sinks is their ability to dissipate large amounts of heat in a small space. This makes them ideal for use in high-power applications such as computer processors, power electronics, and LED lighting. They are also ideal for use in applications where noise and vibration must be minimized, as liquid cooling is much quieter than traditional air cooling methods. Liquid Cooling Plate Heat Sink,Liquid Cooling Plate Radiator,Cooling Plate Aluminum Heat Sink,Aluminum Liquid Heat Sink Suzhou Remgar Metal Manufacturer Co.,Ltd. , https://www.remgaral.com
The company's product features: reduce the number of components in dynamic motion applications, save costs; multiple functions to improve the accuracy and reliability of motion control.
AMISemiconductor (AMIS) has announced the launch of its new single-chip stepper motor driver IC products AMIS-30521 and AMIS-30522. Because the new driver allows some applications to eliminate the need for switches, Hall sensors, flyback diodes, etc., it will greatly reduce component count and material cost in dynamic motion applications.
In the new product, each new mixed-signal IC contains two built-in H-bridges that can drive two-phase stepper motors with currents up to 1600 mA. The speed and load angle outputs allow the main microcontroller to detect the stall rotor and end of operation without the need for additional switches, Hall sensors or optical encoders. In addition to stall detection, these features allow the designer to program the microcontroller to calculate rotor position and dynamically adjust current or speed as required to prevent out-of-step. The drive therefore eliminates the noise and vibration of the end stop and improves the accuracy and reliability of motion control without the need to add components.
The new devices are designed as co-chips that can be used by both the main microcontroller and the DSP. The device has an SPI interface that fully controls the NXT input pulse conversion to provide the appropriate PWM output for the motor coil. In addition, the AMIS-30522 includes a 50 mA regulator and a "watchdog" for external microcontrollers. Both devices offer full-step to 1/32 microstep capability, including compensated and uncompensated half-stepping. Built-in current sensing eliminates the need for external current sense resistors, further reducing component count.
GuidoRemmerie, AMIS Global Industrial ASSP Manager, said: "More and more processing, automotive, textile and building automation applications rely on stepper motors to provide dynamic motion. These new miniature stepper motor drivers enable designers to use the fewest components and the lowest Material cost, complete dynamic motion application quickly and easily."
The new device features an NQFP package with an exposed pad that is less than 1 mm in cross-section and occupies only 7 x 7 mm2. In addition to their small size, these devices offer a range of additional features, including overcurrent, undervoltage and overvoltage, coil open or short, and thermal and diagnostics. In addition to saving board space, small form factor components are also easy to install directly on stepper motors, further saving space and reducing circuit complexity. In addition, the improved SOIC's exposed under pad design greatly enhances thermal resistance and ensures efficient heat dissipation from the IC to the PCB.
Overall, liquid cooling plate heat sinks are a highly efficient and effective way to dissipate heat in electronic devices. They offer superior performance compared to traditional air cooling methods and are ideal for use in high-power and noise-sensitive applications.
AMI universal motor driver improves control accuracy
R & D unit: American AMISemiconductor semiconductor